MT 595:Reliability and Failure of Solid State Devices
This course deals with the electrical, chemical, environmental and mechanical driving forces that compromise the integrity and lead to the failure of electronic materials and devices. Both chip and packaging level failures will be modeled physically and quantified statistically in terms of standard reliability mathematics. On the packaging level, thermal stresses, solder creep, fatigue and fracture, contact relaxation, corrosion and environmental degradation will be treated.
This course provides an in-depth treatment of how to transfer the latest solar thermal technology available to real world applications. It takes the student through the various phases of development of a solar space heating and photovoltaic integrated building; review occupant’s requirements, site analysis, design concept, solar system design, cost estimates, building design, performance predictions and construction. The emphasis of the class is on solar system design methods, economic optimization of solar systems and installation.
This course is an in depth treatment of the principles and practice associated with using solar radiation as an alternate energy source. It examines the science of solar radiation, technologies for its capture and the design principles that are used to apply solar energy in building design.
Schaefer School of Engineering & Science
Department:
Mechanical Engineering / Chemical Engineering & Materials Science
Program:
Materials Science
Mr. Charles Cohn is a Senior Analyst with TechSearch International, Inc. a consulting company that provides technical and marketing analysis to the semiconductor packaging and assembly industry. Concurrently, Mr. Cohn also provides technical assistance and market strategies to Japan Circuit Industrial Co., Ltd. (JCI), a leading edge manufacturer of high density printed wiring board substrates for the semiconductor industry. Prior to joining TechSearch International and JCI, Mr. Cohn was a Distinguished Member of the Technical Staff (DMTS) in the IC Packaging and Interconnection Organization at Agere Systems (Currently LSI). He has been with AT&T / Lucent / Agere for 23 years, as the lead resource on PCB technology, supporting the development of advanced organic PBGA substrates for wire bonded and flip-chip IC interconnections. He maintained close relationships with a broad spectrum of organic substrate suppliers world wide to continually assess their latest technologies and manufacturing capabilities. He has authored chapters in several McGraw Hill, IC Packaging Handbooks, co-edited a McGraw Hill book titled “Failure-Free IC Packages”, conducted many seminars and presented numerous papers on electronic packaging. He was awarded 9 US Patents and 2 Patents Pending on IC Packaging Construction and Thermal Enhancements. Mr. Cohn holds BS, MS & ME degrees in mechanical engineering from Columbia University and has a New Jersey Professional Engineering License.
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