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Course Number: ME 597
Course Name: Integrated Design and Packaging of Electronic Systems
Description: 

This is a multi-disciplinary course in the analysis and design of electronic systems. Topics include: introduction to conduction, convection and radiation heat transfer as applied to electronic systems; design of heat sinks for small to large frames; structural analysis including shock and vibration modeling; introduction to electromagnetic shielding; integrated product design for manufacturing, reliability and quality control.

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